Waferpedia

Comparison ledger

20 36 Surfaceversus7100 Dicing

Blanchard 20 36 Surface, Kulicke & Soffa 7100 Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
7100 DicingKulicke & Soffa
OEMBlanchardKulicke & Soffa
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceKulicke & Soffa 7100 Dicing
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Typesurface grinder[1]—
Applicationdicing and grinding[2]—
Magnetic chuck controlElectro-Matic Neutrol II Magnetic Chuck Control[2]—
Condition notelow hours[1]—
Spindle size—2 inches[3]
Spindle type—DC-brushless[3]
Spindle power—1.2 kW[3]
Spindle mounting—Front-mounted[3]
Spindle bearing—Air-bearing[3]
Maximum spindle speed—60 krpm[3]
Turntable type—Closed-loop[3]
Maximum workpiece size—200 mm x 200 mm[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nano.upenn.edunano.upenn.edu