Waferpedia

Comparison ledger

22 AD 42versusDFG 850 Back

Blanchard 22 AD 42, Disco DFG 850 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DFG
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]Disco DVC 011 Vacuum Coolant Unit[2]
Power—200-208 V, 50/60 Hz, 3 Phase[2]
Spindle Type—Air Bearings[2]
Maximum Spindle Speed—7,000 RPM[2]
External Cooling—Water Cooled[2]
Associated Coolant Unit—Disco DVC 011 Vacuum Coolant Unit[2]
Wafer Sizes—8 inch[3]
Vacuum Coolant Unit—Disco DVC 011[2]
OEM—Disco[3]
Model—DFG 850[3]
Equipment type—Back Grinder[3]
Related unit—Disco DVC 011 Vacuum Coolant Unit[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing