Waferpedia

Comparison ledger

22 AD 42versusDTG 8460 Taiko

Blanchard 22 AD 42, Disco DTG 8460 Taiko, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DTG 8460
Cited variants—
  • DTG 8460 Wafer Backside[1]
Specifications
Phase3 Phase[2]200-2008 V, 50 A, 50/60 Hz, 3 Phase[3]
Frequency60 Hz[2]50/60 Hz[3]
Voltage120 Vac[2]208 V[4]
ConfigurationNo coolant tank[2]3 Chucks[3]
Wafer size—12 inch[3]
Process type—Cassette to Cassette[3]
Number of chucks—3[3]
Current—50 A[3]
Add-on chiller—DTU 1531[3]
Accessories—USV, Duct Unit, Vacuum Unit[3]
Vintage year—2012[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]tarasemi.comtarasemi.com