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Comparison ledger

101-149-053 Gold BoosterversusBJ 939

Branson 101-149-053 Gold Booster, Hesse & Knipps BJ 939, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
BJ 939Hesse & Knipps
OEMBransonHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterHesse & Knipps (H&K) BJ 939
Specifications
Configuration1:1.5[1]60° Bondhead[4]
ManufacturerBranson[2]—
Model101-149-053[2]BJ 939[4]
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Category—Packaging & Bonding[5]
Description—Fully Automatic Heavy Wire Bonder[6]
Bondhead—60° Bondhead[4]
Make—Hesse & Knipps (H&K)[4]
Equipment type—Wire Bonder[4]
Line—Bondjet BJ93X[6]
E-box—E-box[4]
Condition—Refurbished[4]
Vintage—2012[4]
Working area—350 mm x 560 mm (13.8" x 22.0")[7]
Z travel—70 mm (2.75")[7]
P-rotation—440°[7]
Ultrasonic power output—100 W programmable[7]
Wire range—Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent[7]
Ribbon range—Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm)[7]
Machine dimensions—750 x 1560 x 1.897 mm (29.9" x 61.4" x 74.7")[7]
Machine mass—appr. 1400 kg[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]web.archive.orgweb.archive.org
  7. [7]accelonix.nlaccelonix.nl