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Isomet 4000versus321

Buehler Isomet 4000, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMBuehlerDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler Isomet 4000Disco 321
Cited variants—
Specifications
ConfigurationPrecision Linear Sectioning Saw[2]—
Machine nameIsoMet 4000 Linear Precision Saw[1]—
DescriptionAn automatic linear saw that adjusts the feed rate to provide consistent, quality cuts and to prevent specimen and machine damage.[1]—
Cutting systemSMARTCUT system[1]—
Specimen positioning1bcm Specimen Positioning System[1]—
Dimensions21 1/2" W x 29 1/2" D x 13 1/4" H (546 mm x 750 mm x 337 mm)[1]—
Electrical85a2 264 V, 50/60 Hz, 1 Phase[1]—
Motor1 1/4 hp (795 W) 200 a2 5000 rpm[1]—
Noise level73 dB (no load, 12 inches away from machine)[1]—
Shipping weight130 lbs (56 kg)[1]—
Coolant tank0.9 gal (4 liter)[1]—
Coolant flow rate0.7 gal/min (3 liter/min)[1]—
Typeautomatic linear precision saw[1]—
SMARTCUTautomatically adjusts feed rate to provide consistent, quality cuts and prevent specimen and machine damage[1]—
Specimen positioning system1bm Specimen Positioning System[1]—
Blade speed range200·5000 rpm[1]—
Feed rate range0.05·0.75 in/min[1]—
Cutting distance0.01·8.00 inches[1]—
OEM—Disco[3]
Model—321[3]
Equipment type—Wafer Dicing Saw[3]
Facility context—Cleanroom Instrumentation[3]
Application area—Nano and Micro Fabrication[3]
Location—FNT 4.106[3]
Wafer Size—Up to 6 inches[4]
Spindle Power—1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[5]
Spindle Power (alternate)—1500 Watt spindle[4]
Non-Contact Setup—Non Contact Setup[5]
Microscope—Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[5]
Broken Blade Detection—Broken Blade Detection[5]
Light Tower—Includes Light Tower[5]
Chuck Type—6" Universal Chuck (or 6" Porous Film Frame Chuck)[4]
Wafer size capability—Up to 6" wafers[5]
Chuck—6-inch porous film frame chuck[4]
Spindle power—1500-watt spindle[4]
Footprint—Small footprint[4]
Setup—Non-contact setup[5]
Blade break detection—Broken blade detection[5]
Other features—Floppy drive, light tower, blade tools, manuals[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]acmerevival.comacmerevival.com
  2. [2]inventory listing
  3. [3]tmi.utexas.edutmi.utexas.edu
  4. [4]jmind.comjmind.com
  5. [5]gtsaz.comgtsaz.com