Comparison ledger
Dek 03 iX Automatic, Fuji NXT, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NXTFuji | |
|---|---|---|
| OEM | Dek | Fuji |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Dek 03 iX Automatic | Fuji NXT |
| Specifications | ||
| Vintage | 2020[1] | 2005 (3), 2006 (10), 2008[2] |
| Configuration | — | 36 modules / 18 bases[2] |
| Model | — | NXT[2] |
| Product type | — | Pick and place[2] |
| Product description | — | Highly productive, multi-functional modular placing machine[3] |
| Head throughput | — | H24G head achieves 37,500 chips per hour in productivity priority mode[3] |
| High-speed head throughput | — | H24G head achieves 35,000 chips per hour in standard mode[3] |
| Supported PCB size | — | 48 x 48 mm to 610 x 610 mm depending on configuration[3] |
| Supported parts | — | 0201 to 5 x 5 mm, height up to 2.0 mm for H24G[3] |
| High-density placement | — | Wafer and reel part placement in a single unit[4] |
| Supported part handling | — | Supports tray part and reel part placement as well as direct pickup from wafers[4] |
| Cleanroom support | — | Supports cleanroom class 1000[4] |
Plan your fab
Building a Assembly / SMT process? Get a complete equipment list.
Open the fab equipment planner →