Waferpedia

Comparison ledger

248 versus 265

DEK 248 and DEK 265, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
248DEK
265DEK
OEMDEKDEK
CategoryAssembly / SMTAssembly / SMT
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control systemWindows XP
Generation
FamilyDEK 248DEK 265
Cited variants
Specifications
Print area432 mm x 405 mm (17 in x 15.9 in) max[5]
Maximum board size500 mm x 450 mm (19.5 in x 17.5 in) max[5]
Machine accuracy±25 µm @ 3 sigma[5]
Machine repeatability±10 µm @ 3 sigma[5]
Machine capability0.3 mm pitch QFP 0402 chip packages using vision alignment[5]
Vision alignment toolsDEKalign 4[5]
Machine interfaceStand alone[5]
Power supply220 V or 110 V single phase[5]
Power consumptionLess than 1 kW[5]
Air supplyMinimum pressure 4 bar (60 psi), clean and dry[5]
Vacuum supplyInternal vacuum ejector[5]
Approximate weight480 kg (1,056 lbs)[5]
Approximate dimensions1200 mm (W) x 1130 mm (D) x 1140 mm (H) nominal[5]
Screen frame size508 mm x 508 mm (20 in x 20 in) internal[5]
Operator interfaceMachine: easy-touch LCD control console with backlight; Vision: trackball mouse operated[5]
Operational modesDouble squeegee print/print, print/flood, flood/print[5]
Print speed10-70 mm (0.4-2.7 in)/sec; standard independent forward and reverse speed settings in 1 mm (0.04)/sec increments[5]
Menu storage30 alphanumeric[5]
Board filename length12 characters maximum[5]
Language optionsEnglish, German, French[5]
Screen frame typeDEK 265[4]
Screen frame external size736 x 736 x 38/40 mm[4]
Screen frame internal size660 x 660 mm[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]ibesmt.comibesmt.com
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org
  4. [4]web.archive.orgweb.archive.org
  5. [5]web.archive.orgweb.archive.org