Comparison ledger
Denton Vacuum 635LL and Denton Vacuum Thermal, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 635LLDenton Vacuum | ThermalDenton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 200mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum 635LL | Denton Vacuum Thermal |
| Specifications | ||
| Cathodes | 4-cathodes[1] | — |
| Gas / process feedback | RGA, OES-feedback reactive oxygen or nitrogen sputter[1] | — |
| Chuck temperature | heated/cooled chuck to 500C[1] | — |
| Process mode | co-sputtering[1] | — |
| Substrate size | coats up to 200mm diameter substrates[1] | — |
| Configuration | — | Diffusion Pump[2] |
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