Comparison ledger
Denton Vacuum EE-4 and Denton Vacuum Infinity 18, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | EE-4Denton Vacuum | Infinity 18Denton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 3" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum EE-4 | Denton Vacuum Infinity 18 |
| Specifications | ||
| OEM | Denton Vacuum[1] | — |
| Model | EE-4[1] | — |
| Tool type | Electron beam deposition tool[1] | — |
| Hearth positions | 6-position hearth[1] | — |
| Vacuum environment | on the order of e-7 torr[1] | — |
| Chamber design | Dual chamber design[1] | — |
| Automation | Depositions and pump-down/venting sequences are automated using an onboard PLC[1] | — |
| Substrate handling | Rotating substrate holders[1] | — |
| Available materials | Au, Pt, Ag, Ti, Cr, Pd[1] | — |
| Facility | Nanofabrication Facility[1] | — |
| Location | LISE Cleanroom G07[1] | — |
| Configuration | — | Telemark 860 deposition controller panel[2] |
| Chamber size | — | 18" x 23" x 36"[2] |
| Voltage | — | 208V, 3Ph, 50/60Hz, 70A[2] |
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