Waferpedia

Comparison ledger

321 versus DFD 6350 Automatic Dicing

Disco 321 and Disco DFD 6350 Automatic Dicing, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco 321Disco DFD
Specifications
OEMDisco[1]
Model321[1]
Equipment typeWafer Dicing Saw[1]
Facility contextCleanroom Instrumentation[1]
Application areaNano and Micro Fabrication[1]
LocationFNT 4.106[1]
ConfigurationAddition Ionizern for Upgrading ESD Class 1[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]inventory listing