Waferpedia

Comparison ledger

321 versus DFD 6361 Automatic Dicing

Disco 321 and Disco DFD 6361 Automatic Dicing, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco 321Disco DFD
Specifications
OEMDisco[1]
Model321[1]
Equipment typeWafer Dicing Saw[1]
Facility contextCleanroom Instrumentation[1]
Application areaNano and Micro Fabrication[1]
LocationFNT 4.106[1]
Phase3 Phase[2]
Configuration3 Wire + Ground[2]
Full Load Current18 A[3]
Machine Main Breaker Rating20 A[3]
Ampere Rating of Largest Load8 A[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]inventory listing
  3. [3]inventory listing