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3220versusDAD 320 Automatic Dicing

Disco 3220, Disco DAD 320 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DAD
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Phase—3 Phase[3]
Voltage—200V[3]
Make—Disco[3]
Model—DAD 320[3]
Equipment type—Automatic dicing saw[3]
Power—3 Phase[3]
Wafer size—Up to 6" wafers[4]
Microscope—Dual objectives microscope with eyepiece[4]
Spindle—1.5kW spindle[4]
Back up—Floppy Drive back up[4]
Includes—Light Tower[4]
Chuck—6" Universal Chuck[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]gtsaz.comgtsaz.com