Comparison ledger
Disco 3220 and Disco DAD3221, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 3220Disco | DAD3221Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DAD3221 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Type | — | automatic dicing saw[3] |
| Wafer size | — | 100, 150 mm wafers[3] |
| Setup | — | non-contact setup[3] |
| Blade monitoring | — | blade breakage detector[3] |
| Cutting functions | — | circle cut for edge trimming or down sizing[3] |
| Particle/ESD mitigation | — | CO2 injector to prevent particle adhesion and electrostatic discharge damage[3] |
| Alignment aids | — | pattern recognition system; automatic micro-alignment[3] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →