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Comparison ledger

DAD 3230 Automatic Dicing versus DAD3241

Disco DAD 3230 Automatic Dicing and Disco DAD3241, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DADDisco DAD3241
Specifications
Phase3 Phase[1]
Configuration50/60 Hz[1]
Voltage200V[1]
Max. workpiece sizeΦ8”[2]
X-/Y-axis cutting range210 mm[2]
Cutting speed0.1-800 mm/s[2]
Index positioning accuracy0.002/210 mm[2]
Z-axis max. stroke32.2 mm[2]
Moving resolution0.000002 mm[2]
Repeatability accuracy0.001 mm[2]
Θ-axis max. rotating angle320°[2]
Rotation speed range6,000-60,000 rpm[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu