Comparison ledger
Disco DAD 641 Automatic Dicing and Disco DAD3221, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3221Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD | Disco DAD3221 |
| Specifications | ||
| Configuration | FDD card missing (removed due to policy)[1] | — |
| Type | — | automatic dicing saw[3] |
| Wafer size | — | 100, 150 mm wafers[3] |
| Setup | — | non-contact setup[3] |
| Blade monitoring | — | blade breakage detector[3] |
| Cutting functions | — | circle cut for edge trimming or down sizing[3] |
| Particle/ESD mitigation | — | CO2 injector to prevent particle adhesion and electrostatic discharge damage[3] |
| Alignment aids | — | pattern recognition system; automatic micro-alignment[3] |
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