Comparison ledger
Disco DAD3221 and Disco DAD3241, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3221Disco | DAD3241Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | up to Φ8” |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3221 | Disco DAD3241 |
| Specifications | ||
| Type | automatic dicing saw[1] | — |
| Wafer size | 100, 150 mm wafers[1] | — |
| Setup | non-contact setup[1] | — |
| Blade monitoring | blade breakage detector[1] | — |
| Cutting functions | circle cut for edge trimming or down sizing[1] | — |
| Particle/ESD mitigation | CO2 injector to prevent particle adhesion and electrostatic discharge damage[1] | — |
| Alignment aids | pattern recognition system; automatic micro-alignment[1] | — |
| Max. workpiece size | — | Φ8”[2] |
| X-/Y-axis cutting range | — | 210 mm[2] |
| Cutting speed | — | 0.1-800 mm/s[2] |
| Index positioning accuracy | — | 0.002/210 mm[2] |
| Z-axis max. stroke | — | 32.2 mm[2] |
| Moving resolution | — | 0.000002 mm[2] |
| Repeatability accuracy | — | 0.001 mm[2] |
| Θ-axis max. rotating angle | — | 320°[2] |
| Rotation speed range | — | 6,000-60,000 rpm[2] |
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