Comparison ledger
Disco DAD3221 and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3221Disco | KR15Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3221 | Disco KR15 |
| Cited variants | — |
|
| Specifications | ||
| Type | automatic dicing saw[2] | — |
| Wafer size | 100, 150 mm wafers[2] | — |
| Setup | non-contact setup[2] | — |
| Blade monitoring | blade breakage detector[2] | — |
| Cutting functions | circle cut for edge trimming or down sizing[2] | — |
| Particle/ESD mitigation | CO2 injector to prevent particle adhesion and electrostatic discharge damage[2] | — |
| Alignment aids | pattern recognition system; automatic micro-alignment[2] | — |
| Blade designation | — | Disco KR15[3] |
| Blade thickness | — | 200 micron[3] |
| Blade grit | — | low grit[3] |
| Intended materials | — | sapphire, glass, and silicon[3] |
| Max. workpiece size | — | Φ8"[3] |
| Thickness | — | 200 micron[3] |
| Grit | — | Low grit[3] |
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