Comparison ledger
Disco DAD3241 and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3241Disco | KR15Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | up to Φ8” | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3241 | Disco KR15 |
| Cited variants | — |
|
| Specifications | ||
| Max. workpiece size | Φ8”[2] | Φ8"[2] |
| X-/Y-axis cutting range | 210 mm[2] | — |
| Cutting speed | 0.1-800 mm/s[2] | — |
| Index positioning accuracy | 0.002/210 mm[2] | — |
| Z-axis max. stroke | 32.2 mm[2] | — |
| Moving resolution | 0.000002 mm[2] | — |
| Repeatability accuracy | 0.001 mm[2] | — |
| Θ-axis max. rotating angle | 320°[2] | — |
| Rotation speed range | 6,000-60,000 rpm[2] | — |
| Blade designation | — | Disco KR15[2] |
| Blade thickness | — | 200 micron[2] |
| Blade grit | — | low grit[2] |
| Intended materials | — | sapphire, glass, and silicon[2] |
| Thickness | — | 200 micron[2] |
| Grit | — | Low grit[2] |
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