Waferpedia

Comparison ledger

DFG 840 Automatic versus DTG 8460 Taiko

Disco DFG 840 Automatic and Disco DTG 8460 Taiko, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DFGDisco DTG 8460
Specifications
Phase3 Phase[1]200-2008 V, 50 A, 50/60 Hz, 3 Phase[2]
Configuration50/60 Hz[1]3 Chucks[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing