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Comparison ledger

DFG 8830versus15

Disco DFG 8830, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFGLapmaster 15
Specifications
ConfigurationIn-Feed[1]—
Phase3 Phase[1]—
Wafer size6 inch, 8 inch[1]—
MaterialSiC (silicon carbide)[1]—
Max workpiece sizeø150 mm[2]—
Spindle quantity4[2]—
Spindle power (Z1–Z3)6.3 kW[2]—
Spindle speed (Z1–Z3)1,000–4,000 min⁻¹[2]—
Work disc quantity5[2]—
Dimensions (W×D×H)1,400 × 2,500 × 2,000 mm[2]—
Weight≈6,000 kg[2]—
Maximum workpiece size150 mm (6 inch)[2]—
Wafer sizes supported6 inch and 8 inch[1]—
Spindle count4[2]—
Spindle speed range1,000 – 4,000 min⁻¹[2]—
Number of work stations5[2]—
Dimensions (W x D x H)1,400 x 2,500 x 2,000 mm[2]—
Material compatibilitySiC[1]—
In-feed capabilityYes[3]—
Power supply3 Phase, 3 Wire + Ground, 60 A[3]—
MakeDisco[1]—
ModelDFG 8830[1]—
CategoryDicing & Grinding[3]—
Tool typewafer grinder[3]—
Wafer sizes6, 8 inch[1]—
Work station count5[2]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org