Waferpedia

Comparison ledger

DFL 7020 Laser Dicing versus KR15

Disco DFL 7020 Laser Dicing and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
DFL 7020 Laser DicingDisco
KR15Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFL 7020 Laser DicingDisco KR15
Cited variants—
  • KR15-A/KR15-B[1]
Specifications
Blade designation—Disco KR15[2]
Blade thickness—200 micron[2]
Blade grit—low grit[2]
Intended materials—sapphire, glass, and silicon[2]
Max. workpiece size—Φ8"[2]
Thickness—200 micron[2]
Grit—Low grit[2]
DFL 7020 Laser Dicing entryKR15 entry

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]thk.comthk.com
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu