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Comparison ledger

DFS 8960 Surface Planarizationversus100R16

Disco DFS 8960 Surface Planarization, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100R16Strasbaugh
OEMDiscoStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2014 Vintage—
Control system——
Generation——
FamilyDisco DFS 8960 Surface PlanarizationStrasbaugh 100R16
Specifications
ConfigurationFully Automatic[1]—
Phase3 Phase[1]—
ModelDFS 8960 Surface Planarization[2]—
ManufacturerDisco[2]—
CategoryCMP[1]—
Wafer sizes8-inch, 12-inch[2]—
TypeFully automatic surface planarization system[1]—
Power200-230 V[1]—
Frequency50/60 Hz[1]—
Vacuum / pumpingTwo duct units for exhausting the process chambers[1]—
Included itemsSedimentation Tank (collection container); Disco DTU 1531 Chiller unit[2]—
Vintage2014[2]—
type—1 spindle grinder/polisher[3]
drive system—DC drive system with 2 motors[3]
spindle RPM—1-180 RPM[3]
eccentric RPM—1-90 RPM[3]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[3]
capacity—16 inches[3]
spindle size—1-8 TPI[3]
overall dimensions—28 inches x 36 inches x 48 inches[3]
weight—500 lbs[3]
origin—made in the USA[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]excelltechnology.comexcelltechnology.com