Comparison ledger
Electroglas 4090 Automatic Wafer, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 4090 Automatic WaferElectroglas | |
|---|---|---|
| OEM | Electroglas | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas 4090 Automatic Wafer | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Cited variants | — | |
| Specifications | ||
| Manufacturer | Electroglas[2] | Tenney[5] |
| Model | 4090[2] | JR-A-F4T[5] |
| Equipment type | Automatic Wafer Prober[2] | — |
| Wafer size support | 150 mm (6-inch) and 200 mm (8-inch) wafers[3] | — |
| Input voltage | 115VAC[3] | — |
| Alignment accuracy | Micron-level[3] | — |
| Cassette loader | Yes[3] | — |
| Display control module | DCM II or DCM-2[3] | — |
| Material handler module station | CONT (ESC) or MHCM[3] | — |
| Prober control module | Yes[3] | — |
| Vision module | PRM-3[3] | — |
| Chuck | 8 inch hot gold[4] | — |
| Options | OCR, cleaning pad[4] | — |
| Chamber Size | — | 1.2 cubic feet[5] |
| Temperature Range | — | -68°C to +180°C[5] |
| Control | — | +/-1.0°C[5] |
| Short description | — | Junior compact temperature test chambers[5] |
| Control accuracy | — | +/-1.0°C[5] |
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