Comparison ledger
Esec E142, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | E142Esec | 10490West Bond |
|---|---|---|
| OEM | Esec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4” to 12” | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Esec E142 | West Bond 10490 |
| Specifications | ||
| Associated platform | Esec 2100 FC hS[1] | — |
| Option name | E142 strip mapping[1] | — |
| Bonding method | Flip Chip Bonding[1] | — |
| Wafer size | 4” to 12”[1] | — |
| Bonding accuracy | 8 μm @3s (High Accuracy Mode)[1] | — |
| Min. cycle time | 240 ms (incl. dip fluxing)[1] | — |
| Frame size | 6", 8” and 12"[1] | — |
| Die size | 0.2 (with small die kit) to 20 mm[1] | — |
| Die thickness | ≥ 0.05 mm / ≥ 2 mils (thinner on request)[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →