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120 Automated Coater ProcessingversusWS-650-23 B Spin

EV Group 120 Automated Coater Processing, Laurell WS-650-23 B Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMEV GroupLaurell
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 120 Automated Coater ProcessingLaurell WS-650-23 B Spin
Specifications
Configuration50/60 Hz[1]—
Phase3 Phase[1]—
Wafer sizes6 inch, 8 inch[1]—
Frequency50/60 Hz[1]—
Wiring configuration4 Wire + GND[1]—
Vintage2015[1]—
Maximum Substrate Size—ø150 mm wafers; 5" × 5" (127 mm × 127 mm) substrates[2]
Maximum Rotational Speed—12,000 RPM (based on a ø100 mm silicon wafer)[2]
Process Controller—650-series microprocessor controller with PC software support (Spin 3000); real-time interaction, pausing, stopping, and continuation[2]
Power Requirements—95 to 240 VAC, 47/63 Hz, ~300 W[2]
Vacuum Requirements—25–28 inHg (635–711 mm Hg) with flow 4.5 SCFM (0.127 m³/min) at 0 inHg[2]
Nitrogen Purge Pressure—60–70 PSIG (4–5 bar) of N₂ or CDA; consumption 3 ft³/h (0.085 m³/h) for standard motor, 20 ft³/h (0.566 m³/h) for high-performance motor[2]
Housing Material—Solid co-polymer blend (proprietary); optional PTFE (Hostaflon TFM-1600 / Teflon AF) for high-temperature chemistry[2]
Safety Certifications—ETL, UL, CSA, CE, RoHS compliant; door interlock, vacuum interlock, lid interlock[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]laurell.comlaurell.com