Comparison ledger
Hitachi 1305 BSG 3, SUSS MicroTec GT200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | GT200SUSS MicroTec |
|---|---|---|
| OEM | Hitachi | SUSS MicroTec |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | SUSS MicroTec GT200 |
| Specifications | ||
| Chemical consumption | — | Significantly lower compared to conventional processes[1] |
| Hazardous acids | — | None used[1] |
| Organic solvents | — | None used[1] |
| Wafer size | — | up to 200 mm[2] |
| Throughput | — | up to 45 wafers per hour[2] |
| Particle removal efficiency | — | 99% for particles >100 nm[2] |
| Available modules | — | TurbulenStrip, CrustBuster, SpinRinseDry[3] |
| General dimensions (w x d x h) | — | 237 x 420 x 230 cm[3] |
| Supported wafer materials | — | Si, SiC, and more[3] |
| Robot system | — | dual arm robot[3] |
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