Comparison ledger
KLA 2135, KLA Tera Stay SLF 27 Reticle, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2135KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2135 | KLA SLF |
| Specifications | ||
| Product type | wafer inspection system[1] | — |
| Technology | advanced sensor and image processing technologies[1] | — |
| Inspection method | brightfield, small-pixel, high data rate, digital image processing technology[1] | — |
| Defect detection | detects all types of yield-relevant defects on all process layers[1] | — |
| Operational use | in-line monitoring of advanced processes[1] | — |
| Throughput | two- to three-times throughput improvement over the earlier model KLA 2132[1] | — |
| Inspection technology | brightfield, small-pixel, high data rate, digital image processing technology[1] | — |
| Throughput improvement over KLA 2132 | two to three times[1] | — |
| Laser type | 193nm DUV laser[2] | — |
| Laser output power | 200W[2] | — |
| Objective NA | 0.95[2] | — |
| Scan speed | 120 mm/sec[2] | — |
| Power supply input | 3-phase 480V[2] | — |
| Power supply output | 12V DC[2] | — |
| Target process node | 90nm–28nm[2] | — |
| Configuration | — | 1 Reticle loader[3] |
| Equipment type | — | Reticle inspection system[4] |
| Wafer handling | — | 1 reticle loader[4] |
| Telescope option | — | 186nm pixel, 3.2X[3] |
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