Waferpedia

Comparison ledger

AIT II Defect versus F 60 C XT Film Thickness Measurement

KLA AIT II Defect and KLA F 60 C XT Film Thickness Measurement, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyKLA AITKLA F
Specifications
Software Version5.3.20.4[1]
CIMSECS, GEM[1]
Handler SystemDual[1]
Factory InterfaceOpen Cassette[1]
Software2.7.0.0[2]
Wafer Handlingx1 Open Cassette Loader[2]

Plan your fab

Building a Metrology & Inspection process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing