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AIT XUV Darkfield versus HRP 340 Thickness Measurement

KLA AIT XUV Darkfield and KLA HRP 340 Thickness Measurement, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
AIT XUV DarkfieldKLA
HRP 340 Thickness MeasurementKLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA AIT XUVKLA HRP 340
Specifications
Software Version6.3.24.3[1]—
CIMSECS / GEM[1]—
Factory SystemFOUPS[1]—
Handler SystemRobot[1]—
ConfigurationPillar[1]50/60 Hz[2]
Missing PartsIncomplete Wafer Handler Module & Inspection Module[1]—
Phase—1 Phase / 3 Wires[2]
AIT XUV Darkfield entryHRP 340 Thickness Measurement entry

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing