Comparison ledger
KLA AIT XUV Darkfield and KLA UV 1280 SE Thin Film Thickness Measurement, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | ||
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA AIT XUV | KLA UV 1280 SE Thin Film Thickness Measurement |
| Specifications | ||
| Software Version | 6.3.24.3[1] | — |
| CIM | SECS / GEM[1] | — |
| Factory System | FOUPS[1] | — |
| Handler System | Robot[1] | — |
| Configuration | Pillar[1] | Single phase[2] |
| Missing Parts | Incomplete Wafer Handler Module & Inspection Module[1] | — |
| Voltage | — | 200 V[2] |
| Power | — | 1.8 kW[2] |
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