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F 60 C XT Film Thickness Measurement versus INS 3000 DUV Defect

KLA F 60 C XT Film Thickness Measurement and KLA INS 3000 DUV Defect, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
F 60 C XT Film Thickness MeasurementKLA
INS 3000 DUV DefectKLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size—Wafer transport check
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA FKLA INS 3000
Specifications
Software2.7.0.0[1]—
Wafer Handlingx1 Open Cassette Loader[1]—
Wafer size—Wafer transport check[2]
Configuration—Auto Focus check for each lens[2]
Stage—Slight left-to-right tilt observed; minor scratches present[2]
F 60 C XT Film Thickness Measurement entryINS 3000 DUV Defect entry

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing