Comparison ledger
KLA INS 3000 DUV Defect and KLA P 22 H Surface, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | ||
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | Wafer transport check | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA INS 3000 | KLA P |
| Specifications | ||
| Wafer size | Wafer transport check[1] | — |
| Configuration | Auto Focus check for each lens[1] | Step Height Precision Micro 2D Scanner[2] |
| Stage | Slight left-to-right tilt observed; minor scratches present[1] | — |
| Scan Length | — | 60 mm[2] |
| Scan Speed | — | 1 um/sec to 25mm/ sec[2] |
| Scan Method | — | Bi-directional moving stylus[2] |
| Sampling Rate | — | 5, 10, 20, 50, 100, 200, 500 , 1000 Hz[2] |
| Stylus Force | — | Adjustable between 0.05 ~ 50mg[2] |
| Step Height Repeatability, 1 | — | 0.75 nm or 0.1%:Sample Handling:[2] |
| Theta | — | 360[2] |
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