Waferpedia

Comparison ledger

P-2 versus P 22 H Surface

KLA P-2 and KLA P 22 H Surface, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
P-2KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size200mm
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyKLA P-2KLA P
Specifications
ModelP-2[1]
OEMKLA Tencor[1]
Equipment typeProfilometer[1]
Sample table200 mm sample table with vacuum[2]
Measurement rangeMeasures steps from 100 Å to 300 µm[2]
Maximum sample thickness20 mm[2]
Minimum sample length25 mm[2]
Feature3D scan option[2]
ConfigurationStep Height Precision Micro 2D Scanner[3]
Scan Length60 mm[3]
Scan Speed1 um/sec to 25mm/ sec[3]
Scan MethodBi-directional moving stylus[3]
Sampling Rate5, 10, 20, 50, 100, 200, 500 , 1000 Hz[3]
Stylus ForceAdjustable between 0.05 ~ 50mg[3]
Step Height Repeatability, 10.75 nm or 0.1%:Sample Handling:[3]
Theta360[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]inventory listing