Comparison ledger
Kulicke & Soffa 4523 Deep Wedge, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 4523 Deep WedgeKulicke & Soffa | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Kulicke & Soffa | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kulicke & Soffa 45xx | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | heated chuck[1] | — |
| OEM | Kulicke & Soffa[1] | — |
| Model | 4523 Deep Wedge[1] | — |
| Equipment type | Bonders[2] | — |
| Brand | Kulicke And Soffa[2] | — |
| Description | Vertical feed wedge bonder[2] | — |
| Included optics | Stereo zoom optics[2] | — |
| Ultrasonic generator | Ultrasonic generator[2] | — |
| Operating mode | Manual Z lever or semiauto mode[2] | — |
| Force control | Electronic force control[2] | — |
| Bonding materials | Aluminum wire, gold wire, and ribbon[3] | — |
| Applications | Simple discrete devices, complex hybrid devices, microwave devices, and deep cavity devices[3] | — |
| Deep access option | Deep access option with tail adjust system[3] | — |
| Bonding area | 134 x 134 mm (5.3 x 5.3 inch)[3] | — |
| Throat depth | 143 mm (5.6 inch)[3] | — |
| Gross table motion | 140 mm (5.5 inch)[3] | — |
| Fine table motion | 14 mm (0.55 inch)[3] | — |
| Mouse ratio | 6:1[3] | — |
| Z motion system | DC servo / LVDT control[3] | — |
| Z travel low reset | 6.6 mm (260 mil)[3] | — |
| Z travel high reset | 12.7 mm (500 mil)[3] | — |
| Ultrasonic system | High Q 60 kHz transducer with PLL ultrasonic generator[3] | — |
| Low ultrasonic power | 1.3 W[3] | — |
| High ultrasonic power | 2.5 W[3] | — |
| Bond time | 10-100 mSec / 10-1000 mSec[3] | — |
| Bond force | Force coil 10-160 gr.[3] | — |
| Wire termination | Clamp tear[3] | — |
| Wire feed angle | 30/45 option 90[3] | — |
| Modes of operation | Semi-Auto, Manual, Stitch[3] | — |
| Temperature controller | Up to 250 ±0.5 C[3] | — |
| Electrical requirements | 100-120/220-240V 10% 50/60 Hz 250VA max.[3] | — |
| Physical dimensions | 680 mm (27") W x 700 mm (27.5") D x 530 mm (21") H[3] | — |
| Shipping weight | 55 kg (122 lb)[3] | — |
| Net weight | 31 kg (69 lb)[3] | — |
| Standards | Complies with UL and CE standards[3] | — |
| Wafer Size | — | 6 inch[4] |
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