Waferpedia

Comparison ledger

Rapid Pro Automaticversus10100

Kulicke & Soffa Rapid Pro Automatic, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Rapid Pro AutomaticKulicke & Soffa
10100West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa Rapid Pro AutomaticWest Bond 10100
Cited variants
  • RAPID Pro LA[1]
  • RAPID Pro ELA[1]
  • RAPID Pro LA (Large Area)[2]
  • RAPID Pro ELA (Extended Large Area)[2]
—
Specifications
PowerApprox. 2.6 kVA[3]—
Wire size (Au, Cu, Ag)0.6 to 2.5 mil[3]—
Bond placement accuracy (3 sigma)2 µm[3]—
Bonding area X56 mm[4]—
Bonding area Y (standard)80 mm[1]—
Bonding area Y (LA variant)87 mm[1]—
Bonding area Y (ELA variant)80 mm[1]—
Bonding methodBall bonder[4]—
Maximum wire length76 mm (with 1.0 mil wire)[1]—
Minimum loop height40 µm (with 0.6 mil wire)[1]—
Wire pitch35 µm[4]—
Wire sway25 µm (wire length ≤ 2.54 mm)[4]—
Power supply200-240 VAC, -15% to 10%, single phase, 50/60 Hz, 2.6 kVA[4]—
Air consumption185 L/min[4]—
Air pressure3.52 kg/cm²[4]—
Net weight590 kg[4]—
Dimensions (base machine with MHS)889 x 1003 mm[4]—
Magazine dimensions305 x 110 x 178 mm[4]—
Leadframe dimensions300 x 92 mm[4]—
Same leadframe type conversion time4 min[4]—
Different leadframe type conversion time8 min[4]—
Die pad downsetUp to 2.3 mm[4]—
Vision systemHigher resolution progressive scan, CCD camera + dual magnification (2x & 6x), optional programmable focus[1]—
ROHS compliantYes[1]—
Bonding Area (X x Y)56 x 80 mm[4]—
Air Pressure3.52 kg/sq cm[4]—
Bonding Wire Length7.6 mm[4]—
Different Leadframe Type8 min (change time?)[4]—
Gold Wire Size0.6 to 2.5 mil[4]—
Minimum Loop Height40 µm[4]—
Overall Dimensions (Base Machine with MHS)x 889 x 1003 mm (first dimension not stated)[4]—
Placement Accuracy2 µm[4]—
Same Leadframe Type4 min (change time?)[4]—
Wire Sway25 µm[4]—
Power ConsumptionApprox. 2.6 kVA[3]—
Voltage200 / 220 / 240 VAC[3]—
Frequency50/60 Hz[3]—
Current15 A[3]—
PhaseSingle phase[3]—
ManufacturerKulicke & Soffa Industries, Inc.[4]—
ModelRapid Pro Automatic[3]—
TypeAutomatic wire bonder[3]—
Material handlingAutomatic magazine material handling[3]—
Wire size0.6 to 2.5 mil Au, Cu, and Ag wire[3]—
Placement accuracy2 um bond placement accuracy at 3 sigma[3]—
Bonding area56 mm x 80 mm[4]—
Vintage2020[3]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]scribd.comscribd.com
  2. [2]zaratech.bizzaratech.biz
  3. [3]inventory listing
  4. [4]semiconductor.directorysemiconductor.directory