Comparison ledger
Lam Research IPEC Avanti 472, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | IPEC Avanti 472Lam Research | 108TPR Hoffman |
|---|---|---|
| OEM | Lam Research | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | Single wafer | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research IPEC | PR Hoffman 108T |
| Specifications | ||
| Configuration | Fully automated[1] | — |
| Wafer size | Single wafer[2] | up to 12 in wafers[7] |
| Manufacturer | Lam / IPEC[3] | — |
| Model | Avanti 472[3] | — |
| Equipment type | CMP (Chemical Mechanical Polisher)[3] | — |
| Wafer sizes | 4, 5, 6, 8 inch[1] | — |
| Automation | Fully automated[1] | — |
| Process capability | Capable of two-step polishing to maximize wafer processing capability and quality[1] | — |
| Configured wafer size | 150 mm wafers[4] | — |
| OEM | Lam / IPEC[1] | — |
| Category | CMP (Chemical Mechanical Polisher)[1] | CMP[7] |
| Processing mode | Single wafer[1] | — |
| Polishing capability | Capable of two-step polishing[1] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[5] |
| machine class | — | for double-sided planetary lapping & polishing machines[5] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[5] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[5] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[6] |
| Model designation | — | 108T[7] |
| Carrier type | — | insert/lapping carrier[7] |
| Machine type | — | double-sided planetary lapping and polishing machines[7] |
| Compatible machine examples | — | 9B / S-F / Lapmaster LSP-9 / etc.[7] |