Comparison ledger
Lapmaster 15, Strasbaugh 7 AF Intelligent Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | 7 AF Intelligent WaferStrasbaugh |
|---|---|---|
| OEM | Lapmaster | Strasbaugh |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 15 | Strasbaugh 7 AF Intelligent Wafer |
| Specifications | ||
| Input Power | 110 Vac[1] | — |
| Plate Diameter | 15 inches (381 mm)[2] | — |
| Number of Conditioning Rings | 3[2] | — |
| Ring ID | 5.5 inches (140 mm)[2] | — |
| Standard RPM | 60[2] | — |
| RPM Range (Variable Speed Drive) | 0-60[2] | — |
| Drive Motor - Lapper | 0.5 HP (0.37 kW)[2] | — |
| Drive Motor - Polisher | 0.75 HP (0.56 kW)[2] | — |
| Length | 25 inches (635 mm)[2] | — |
| Width | 20 inches (508 mm)[2] | — |
| Height | 24 inches (610 mm)[2] | — |
| Estimated Shipping Weight | 285 lbs (129.3 kg)[2] | — |
| Phase | — | 3 Phase[3] |
| OEM | — | Strasbaugh[3] |
| Model | — | 7 AF[3] |
| Equipment name | — | Strasbaugh 7 AF Intelligent Wafer Grinder[3] |
| Type | — | Wafer grinder[4] |
| Electrical phase | — | 3 Phase[3] |
| Described function | — | Wafer backgrinding[5] |
| Power & electrical | — | 3 Phase[4] |
| Configuration | — | Two air bearing grind spindles and two air bearing work holding spindles[6] |
| Process characteristics | — | High volume throughput[6] |
| Grinding method | — | Adaptive grinding determined by grinding wheel dynamics[6] |
| Mechanical design feature | — | Each wafer remains on the same work spindle for both grind steps[6] |
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