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Comparison ledger

DS 266versusMWS 610 SD

Meyer Burger DS 266, Takatori MWS 610 SD, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Documented as functional equivalents— Same function class: Dicing & Grinding, null[1]
Side-by-side comparison of selected equipment models
Attribute
DS 266Meyer Burger
MWS 610 SDTakatori
OEMMeyer BurgerTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyMeyer Burger DS 266Takatori MWS 610
Specifications
Voltage400V[1]—
Configuration120A[1]Slurry supply tank with pump and agitator: 24 gal[3]
Frequency50 Hz[1]—
Current120 A[1]—
Vintage2008[1]2017[3]
Wafer Size8 inch[2]—
Includes HDD & SoftwareYes[2]—
Operating Hours—35076[3]
High rocking angle—± 3°[3]
Slurry supply tank capacity—24 gallons[3]
Rocking angle—±3°[3]
Vintage year—2017[3]
Slurry temperature controller—Present[3]
Slurry flow meter control system—Present[3]
Spindle axis temperature controller—Present[3]
Disposable reel adapter—Present[3]
Load cell electronic control—Present[3]
Electric control cabinet—Present[5]
Power transformer—Present[5]
Rocking bearing system—Present[5]
Ball screw system for work table—Present[5]
Machine type—Wire saw[3]
Slurry supply tank—24 gal with pump and agitator[3]
HDD—Included, completely wiped, without software for operation[3]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]inventory listing