Comparison ledger
MRSI H3, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H3MRSI | 10100West Bond |
|---|---|---|
| OEM | MRSI | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2019 Renamed product name · 2019 Name change for shipments | — |
| Control system | — | — |
| Generation | — | — |
| Family | MRSI H3 | West Bond 10100 |
| Cited variants | — | |
| Specifications | ||
| Placement accuracy (3 sigma, before improvement) | ±3 micrometers[1] | — |
| Placement accuracy (3 sigma, after improvement) | ±1.5 micrometers[1] | — |
| Product line type | high-speed, high-precision and flexible eutectic and epoxy die bonding systems[1] | — |
| Product type | Die bonder[2] | — |
| Name change | Former name of the MRSI-H product[2] | — |
| Shipment rename date | October 1, 2019[1] | — |
| Placement accuracy | ±1.5 micrometers at 3 sigma[1] | — |
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