Comparison ledger
Multitest MT8589, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MT8589Multitest | |
|---|---|---|
| OEM | Multitest | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | 2000– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Multitest MT8589 | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Specifications | ||
| Type | Gravity Handler[1] | — |
| Contact site | dual contact site[1] | — |
| Temperature range | tri-temp from -55 to 155 °C[1] | — |
| Conversion time | kitable; simple conversion in 10 to 15 min.[1] | — |
| Maximum throughput | 4,800 uph[1] | — |
| Package types | 250 different package types (DIP, SO, TO, PLCC)[1] | — |
| Contacting | standard to high power Kelvin[1] | — |
| Installed base | more than 2,000 systems[1] | — |
| Device size | 5 mm to 60 mm device length; width up to 40 mm; pitch down to 0.65 mm[1] | — |
| Interface | SECS-GEM Interface[1] | — |
| Device spectrum | high power contact spring[1] | — |
| Contact sites | Dual contact site[1] | — |
| Supported package families | DIP, SO, TO, PLCC[1] | — |
| Device pitch | Down to 0.65 mm[1] | — |
| Device length | 5 mm to 60 mm[1] | — |
| Device width | Up to 40 mm[1] | — |
| Applications | Automotive power devices, consumer electronics, logic and analog[1] | — |
| Contact type | Standard to high power Kelvin[1] | — |
| Chamber Size | — | 1.2 cubic feet[2] |
| Temperature Range | — | -68°C to +180°C[2] |
| Control | — | +/-1.0°C[2] |
| Manufacturer | — | Tenney[2] |
| Model | — | JR-A-F4T[2] |
| Short description | — | Junior compact temperature test chambers[2] |
| Control accuracy | — | +/-1.0°C[2] |
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