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Comparison ledger

Model 800Eversus150 e Mask

OAI Model 800E, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMOAISUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOAI Model 800ESUSS MicroTec 150 e Mask
Specifications
Product categoryMask aligner[1]—
Operation modeSemi-automatic[2]—
Exposure sidesFrontside and backside[2]—
Feature levelAdvanced features and specifications found most often in costly automated production mask aligners[2]—
System typeFront & backside semi-automatic mask aligner[3]—
PlatformBuilt on OAI's modular platform[3]—
Control systemWindows 10 control and recipe storage[4]—
Alignment stagesJoystick-controlled alignment and optics stages[3]—
Exposure modesVacuum contact, hard contact, soft contact, proximity[4]—
Substrate sizeUp to 8" square[4]—
Mask sizeUp to 9" x 9"[4]—
Alignment camerasDual 1 MP GIGE CCD cameras; 4 total in backside configuration[4]—
Wedge correctionNon-contact 3-point wedge effect correction / auto wedge effect compensation[4]—
OpticsOAI Advanced Beam Optics[3]—
UV sourceHigh-intensity broadband Hg/Hg-Xe arc lamp (320-450 nm)[5]—
Beam uniformityExceptional uniformity[3]—
ResolutionSub-micron capability with optimized resist and process[5]—

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Sources (5)Every fact above is drawn from these public sources
  1. [1]oainet.comoainet.com
  2. [2]oainet.comoainet.com
  3. [3]oainet.comoainet.com
  4. [4]oainet.speedstorecdn.comoainet.speedstorecdn.com
  5. [5]instrumenthive.cominstrumenthive.com