Comparison ledger
Palomar 8000 i, Shinkawa UTC 5000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8000 iPalomar | UTC 5000Shinkawa |
|---|---|---|
| OEM | Palomar | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2013 system debut | — |
| Control system | — | — |
| Generation | — | — |
| Family | Palomar 8000 | Shinkawa UTC |
| Cited variants |
| — |
| Specifications | ||
| Configuration | upgraded to a 120kHz transducer[3] | Complete with HDD[5] |
| Model | 8000 i[3] | — |
| Asset # | 81383[3] | — |
| Type | Wire Bonder[3] | Wire Bonder[1] |
| Description | upgraded to a 120kHz transducer[3] | — |
| Vintage | 2019 Vintage[3] | 2019[5] |
| System debut | Debut of the 8000i Wire Bonder/Ball Bumper in 2013[2] | — |
| Bond type | Thermosonic ball and wire bonding, ball bumping[4] | — |
| Cycle time | 0.125 sec/wire; 0.077 sec/bump[4] | — |
| Wire pitch | 50 μm using 20 μm wire[4] | — |
| Repeatability | +/- 2.5 μm, 3σ[4] | — |
| Deep access capillary | Standard: 11.10 mm; Optional: 11.94 mm / 15.88 mm / 19.05 mm[4] | — |
| Bond area | 304.8 x 152.4 mm (12" x 6")[4] | — |
| Wire spool size | 50.8 mm (2") double flanged spool[4] | — |
| Wire diameter | 17.8 to 50.8 μm (0.7 to 2.0 mil)[4] | — |
| Power | 200, 208, 220, or 240 VAC, 50/60 Hz, 30A, single phase[4] | — |
| Vacuum | -25 inHg (85 kPa)[4] | — |
| Air at bonder inlet | CDA: 60 psig @ 4 SCFM[4] | — |
| Dimensions | Height: 1,778 mm (70"); Footprint: 800 x 953 mm (31.5" x 37.5")[4] | — |
| Weight | 1,800 lbs. (816.47 kg)[4] | — |
| Control system | Linear motor/encoder (X/Y), voice coil/encoder (Z linear / Z rotary), Servo EFO/encoder[4] | — |
| Bonding mode | Thermosonic ball and wire bonding, ball bumping[4] | — |
| Capabilities | Ball bumping, stud bumping, wafer bumping, chip bumping, customized looping profiles[4] | — |
| Resolution | 0.10 μm X/Y axis[4] | — |
| Vision system | Cognex Series 8500[4] | — |
| Applications | Large complex hybrids, HB/HP LED arrays, optoelectronic packaging, chip-on-board (COB), system in packages (SiPs), specialty lead frames, automotive assemblies, flex circuits, multi-chip modules (MCMs), fine pitch devices, LEDs with running stitch[4] | — |
| Wafer Size | — | 12 inch[5] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →