Comparison ledger
Rorze 03 RR 8120-001-001 Wafer Exchanger, TechWing TW 350 H Memory, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TW 350 H MemoryTechWing | |
|---|---|---|
| OEM | Rorze | TechWing |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Rorze 03 RR 8120-001-001 Wafer Exchanger | TechWing TW 350 H Memory |
| Specifications | ||
| Wafer size | 8 inch[1] | — |
| Manufacturer | Rorze[1] | — |
| Model | 03 RR 8120-001-001[1] | — |
| Equipment type | Wafer Exchanger[1] | — |
| Power supply | — | 40-55 Amp[3] |
| Configuration | — | IPC Pentium-IV Controller[3] |
| Operating system | — | Windows 2000[3] |
| Touch | — | screen monitor[3] |
| Jam Rate | — | <1/20,000[3] |
| Power Capacity | — | 23 KVA[3] |
| Power Requirement | — | AC220V, 3Phase, 1PE, 50~60Hz[3] |
| Temperature capability | — | −40°C ~ +125°C[3] |
| Machine type | — | Memory test handler[3] |
| Controller | — | IPC Pentium-IV Controller[3] |
| Jam rate | — | <1/20,000[3] |
| No COK | — | No COK[3] |
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