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Comparison ledger

03 RR 8120-001-001 Wafer ExchangerversusNextest Magnum II EV Final

Rorze 03 RR 8120-001-001 Wafer Exchanger, Teradyne Nextest Magnum II EV Final, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMRorzeTeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyRorze 03 RR 8120-001-001 Wafer ExchangerTeradyne Nextest Magnum
Specifications
Wafer size8 inch[1]—
ManufacturerRorze[1]—
Model03 RR 8120-001-001[1]—
Equipment typeWafer Exchanger[1]Tester[3]
Configuration—Self- contained, low-power engineering test system[3]
Description—Self-contained, low-power engineering test system[3]
Digital I/O—Up to 128 digital I/O pins[3]
Option board—DPS, VRC, or MPAC option board[3]
Air supply—Internal air compressor air to operate the load board latch mechanics[3]
Power—Standard 110 VAC power (220 VAC Europe)[3]
DPS board—4 DPS Board[3]
Channel count—128 channel (IO)[3]
Connectivity—LAN port and GPIB available[3]
Site assembly—Only one site assembly board in these EVs[3]
Prober connection—MVT tools connected a P12XL TEL Prober[3]
PC OS—Windows Server 2019 Standard[3]
Tester software—Nextest Version H8.5.2.1[3]
Loader board note—No test card connect by Loader Board[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing