Comparison ledger
SUSS MicroTec 150 e Mask, SUSS MicroTec BA 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 150 e MaskSUSS MicroTec | BA 8SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec 150 e Mask | SUSS MicroTec BA 8 |
| Cited variants | — |
|
| Specifications | ||
| Phase | — | 1+N / 2 Phase[2] |
| Configuration | — | 50/60 Hz[2] |
| Power | — | 1kVA[2] |
| Type | — | bond aligner[3] |
| Application | — | wafer bonding and alignment[3] |
| Power frequency | — | 50/60 Hz[2] |
| Voltage | — | 208-230 V[2] |
| Alignment capability | — | submicron wafer-to-wafer bond alignment[1] |
| Alignment modes | — | top, bottom, and multi-layer alignment modes[1] |
| Optical options | — | visible light and infrared[1] |
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