Waferpedia

Comparison ledger

, TPS JR-A-F4T Junior compact temperature test chambersversusUltra Flex RF HPC

Tenney , TPS JR-A-F4T Junior compact temperature test chambers, Teradyne Ultra Flex RF HPC, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMTenneyTeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTenney , TPS JR-A-F4T Junior compact temperature test chambersTeradyne Ultra Flex
Specifications
Chamber Size1.2 cubic feet[1]—
Temperature Range-68°C to +180°C[1]—
Control+/-1.0°C[1]—
ManufacturerTenney[1]—
ModelJR-A-F4T[1]Ultra Flex RF HPC[2]
Short descriptionJunior compact temperature test chambers[1]—
Control accuracy+/-1.0°C[1]—
Slot 0—GigaDig HD 2[2]
Slot 1—HDVS 1[2]
Slot 2—MWMeasure[2]
Slot 3—HSDI[2]
Slot 4—HSS 6400[2]
Slot 6—HSD-M[2]
Slot 7—HSD-M[2]
Slot 8—HSD-M[2]
Slot 9—HSD-M[2]
Slot 10—MWSynthRef[2]
Slot 11—Turbo-Frame[2]
Slot 12—HSDI[2]
Slot 13—HSDI[2]
Slot 14—HSD-M[2]
Slot 15—HSD-M[2]
Slot 16—HSD-M[2]
Slot 17—HSD-M[2]
Slot 18—DC-30[2]
Slot 19—HexVS[2]
Slot 20—DC-30[2]
Make—Teradyne[2]
Category—Test & Probe[3]
Installed modules—Slot 0: GigaDig HD 2; Slot 1: HDVS 1; Slot 2: MWMeasure; Slot 3: HSDI; Slot 4: HSS 6400; Slot 6: HSD-M; Slot 7: HSD-M; Slot 8: HSD-M; Slot 9: HSD-M; Slot 10: MWSynthRef; Slot 11: Turbo-Frame; Slot 12: HSDI; Slot 13: HSDI; Slot 14: HSD-M; Slot 15: HSD-M; Slot 16: HSD-M; Slot 17: HSD-M; Slot 18: DC-30; Slot 19: HexVS; Slot 20: DC-30; Slot 21: HexVS; Slot 22: MWSynthLO[2]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com