Comparison ledger
Varian 0332 F 9453 302 Diffusion, YES PB 12 2 P CP Polyimide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | Varian | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | Up to 50 wafers per batch (two 25-wafer cassettes) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Varian 0332 F 9453 302 Diffusion | YES PB 12 2 P CP Polyimide |
| Specifications | ||
| Asset Number | 142841[1] | — |
| Last Confirm Date | October 14, 2025[2] | — |
| Make | Varian[1] | Yes[4] |
| Model | 0332 F 9453 302[1] | PB 12 2 P CP[4] |
| Category | Thermal / Diffusion[3] | — |
| Tool type | diffusion pump[3] | — |
| Voltage | — | 208 V, 3-phase, 50/60 Hz, 40 A[4] |
| Configuration | — | Temperature Control:[4] |
| Operating temperature | — | ambient to 450 °C (optional high-temp version up to 550 °C)[4] |
| Temperature uniformity | — | ±5 °C at dwell after stabilization (empty chamber, > 50 Torr)[4] |
| Average heat-up rate | — | 3.5 °C/min (150 °C → 450 °C)[4] |
| Average cool-down rate | — | 3.0 °C/min (450 °C → 150 °C)[4] |
| Power | — | 208 V, 3-phase, 50/60 Hz, 40 A[4] |
| Optional high-temperature version | — | up to 550 °C[4] |
| Controller | — | PLC controller with color touchscreen operator interface[4] |
| Programmable temperature profiles | — | 8 programmable temperature profiles (up to 200 with YES-DAQ-LR option)[4] |
| Interface | — | RS-232 interface for data download/monitoring[4] |
| Vacuum gauge | — | Digital Granville-Phillips™ dual set-point vacuum gauge[4] |
| Vacuum plumbing | — | VCR fittings[4] |
| Gas input | — | 1 standard process-gas input (up to 3 optional with mass-flow controllers)[4] |
| Chamber material | — | 316L stainless steel[4] |
| Cooling | — | Air-cooled with external forced convection[4] |
| Capacity | — | up to 50 wafers per batch[4] |
| Wafer cassette configuration | — | two 25-wafer cassettes[4] |
| Maximum wafer size | — | up to 300 mm[4] |
| Oxygen concentration | — | ≤ 10 ppm over background[4] |
| Chamber dimensions | — | 53.34 cm (ID) × 104.06 cm (D) (≈ 21″ × 41″)[4] |
| Process area | — | 37.59 cm (W) × 74.4 cm (D) × 36.07 cm (H) (≈ 14.8″ × 29.3″ × 14.2″)[4] |
| Overall dimensions | — | 89.48 cm (W) × 174.57 cm (D) × 138.7 cm (H) (≈ 35.23″ × 68.73″ × 54.61″)[4] |
| Wafer size | — | Up to 50 wafers per batch (two 25-wafer cassettes)[4] |
| Equipment type | — | Polyimide Bake Oven[4] |
| Chamber cooling | — | Air-cooled with external forced convection[4] |
| Batch capacity | — | Up to 50 wafers per batch (two 25-wafer cassettes)[4] |
| Wafer size capacity | — | Up to 300 mm[4] |
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