Waferpedia

Comparison ledger

-407B-1-S-CES293 RobotversusBTZ-133 Temperature

ABM -407B-1-S-CES293 Robot, Espec BTZ-133 Temperature, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMABMEspec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyABM -407B-1-S-CES293 RobotEspec BTZ-133 Temperature
Specifications
ModelABM-407B-1-S-CES293[1]BTZ-133[2]
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Temperature—Temperature Low -70°C[2]
Manufacturer—Espec[2]
Short description—Temperature chamber[2]
Condition—Used[2]
Year—2011[2]
Exterior dimensions (W x D x H)—30.25" x 33.5" x 34"[2]
Interior dimensions (W x D x H)—19.6" x 11" x 12"[2]
Workspace volume—1.5 cubic ft (42 L)[2]
Temperature low—-70°C[2]
Temperature high—180°C[2]
Input power—115 V[2]
Average change rate heating—3.5°C/min[2]
Average change rate cooling—3°C/min[2]
Heat-to-room peak—5,100 BTU/Hr[2]
Maximum sound level—65 dBA at 1 meter away[2]
Temperature fluctuation—±0.5C at control sensor[2]
Includes—Base cart with casters[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]dealer listingwotol.com