Comparison ledger
Applied Materials 0010-03254 E Chuck, Semitool Equinox Semiconductor Wafer Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Semitool |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Semitool Equinox |
| Specifications | ||
| Configuration | — | Single head, manual plater with one process head (100mm) and one SRD (100mm)[1] |
| Voltage | — | 208V, 3 Ph, 50/60 Hz, 40A[1] |
| Manufacturer | — | Semitool[1] |
| Model | — | Equinox Semiconductor Wafer Electroplating System[1] |
| Process head | — | One process head (100mm)[1] |
| SRD | — | One SRD (100mm)[1] |
| Anode | — | Titanium anode[1] |
| Reactor type | — | Electroplating cup reactors for uniform films[1] |
| Load system | — | Simple manual load system[1] |
| Chambers | — | Two chambers[1] |
| Power | — | 208V, 3 Ph, 50/60 Hz, 40A[1] |
| Control | — | Computer powers on[1] |
| Condition note | — | Appears to have residual gold plating solution in the lines[1] |
| Tool type | — | Single-head manual plater[1] |