Comparison ledger
Applied Materials 0010-03254 E Chuck, Tokyo Electron Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | SpinTokyo Electron |
|---|---|---|
| OEM | Applied Materials | Tokyo Electron |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1997– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Tokyo Electron Spin |
| Specifications | ||
| Configuration | — | parts[1] |
| Manufacturer | — | Tokyo Electron[2] |
| Equipment class | — | spin coater[1] |
| Specific example noted | — | Tel spin coater[2] |
| Wafer size | — | 100mm and 150mm wafers[3] |
| Process type | — | automatic (batch) spin-coating and development[3] |
| HMDS module | — | HMDS vapor-prime module[3] |
| Photoresist dispense lines | — | 4 photoresist dispense lines[3] |
| BARC dispense lines | — | 4 BARC dispense lines[3] |
| Maximum substrate thickness | — | ~750um[3] |
| Introduction year of CLEAN TRACK ACT 8 | — | 1997[4] |
| Handle wafer size of CLEAN TRACK ACT 8 | — | 200mm wafers[4] |